KR101213147B1
In the texturing method using a texturing agent composition of a single crystal silicon wafer for solar cells, Mixing 45% -potassium hydroxide solution and a texturing agent in ion-exchanged water (S1); And In step S1, the mixture of 45% -potassium hydroxide solution and texturing agent mixed with ion exchanged water is etched at 80 to 90 ° C. and the etching time is 10 to 25